MC68MH360ZP33LR2
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 4.75V 33MHz
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Technical
Packaging Tape & Reel (TR)
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 357
Terminal Finish TIN LEAD
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Technology HCMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 5V
Reach Compliance Code not_compliant
Frequency 33MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 357
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.25V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.75V
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN
Halogen Free Not Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Number of Serial I/Os 4
Number of Cores 1
Bus Compatibility 68000
Communication Protocol ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
Dimensions
Length 25mm
Width 25mm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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