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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description Contains Lead SERIAL IO/COMMUNICATION CONTROLLER LAN 68000 BALL IC Microprocessor 70C 25mm 2.7V 25MHz
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant

Dimensions

Width 25mm
Length 25mm

Technical

Communication Protocol ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC
Bus Compatibility 68000
Number of Cores 1
Number of Serial I/Os 4
External Data Bus Width 32
Low Power Mode YES
Boundary Scan YES
Address Bus Width 32
Halogen Free Not Halogen Free
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, LAN
Supply Voltage-Min (Vsup) 2.7V
Temperature Grade COMMERCIAL
Supply Voltage-Max (Vsup) 3.3V
Qualification Status Not Qualified
Pin Count 357
Time@Peak Reflow Temperature-Max (s) 30
Frequency 25MHz
Reach Compliance Code not_compliant
Supply Voltage 3V
Peak Reflow Temperature (Cel) 220
Terminal Form BALL
Terminal Position BOTTOM
Technology HCMOS
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Terminal Finish Tin/Lead (Sn/Pb)
ECCN Code EAR99
Number of Terminations 357
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0
Packaging Tape & Reel (TR)

Physical

Surface Mount YES
Package / Case BGA

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