KMPC860ENZQ66D4
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description
FIXED POINT MICROPROCESSOR RISC BOTTOM BALL IC Microprocessor 95C 25mm 3.3V 32b
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Inventory: 9862
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Number of Pins 357
Weight 2.1737g
Technical
Packaging Bulk
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3
Number of Terminations 357
Terminal Finish Tin/Lead (Sn/Pb)
Max Operating Temperature 95°C
Min Operating Temperature 0°C
Subcategory Microprocessors
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 3.3V
Frequency 66MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 357
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Frequency (Max) 66MHz
Data Bus Width 32b
Halogen Free Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Number of Cores 1
Dimensions
Height Seated (Max) 2.52mm
Length 25mm
Compliance
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
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