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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FIXED POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 100C 23mm 1.8V 32b
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 256
Weight 1.662955g

Technical

Packaging Bulk
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.8V
Reach Compliance Code unknown
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
RAM Size 8kB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Frequency (Max) 100MHz
Data Bus Width 32b
Halogen Free Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Number of Cores 1

Dimensions

Height Seated (Max) 2.54mm
Length 23mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free

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