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Package BGA
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description FLOATING POINT MICROPROCESSOR RISC Not Qualified BALL IC Microprocessor 105C 29mm 1.2V 400MHz
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Technical Details

Physical

Package / Case BGA
Surface Mount YES
Number of Pins 620

Technical

Packaging Bulk
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3
Number of Terminations 620
ECCN Code 5A002
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 105°C
Min Operating Temperature 0°C
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Reach Compliance Code unknown
Frequency 400MHz
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 620
Qualification Status Not Qualified
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Halogen Free Halogen Free
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Number of Cores 1

Dimensions

Height Seated (Max) 2.46mm
Length 29mm
Width 29mm

Compliance

RoHS Status RoHS Compliant
Lead Free Lead Free

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