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Package TSSOP
Category Integrated Circuits (ICs) / Embedded - Microprocessors
Description Contains Lead MICROCONTROLLER 8051 J BEND IC Microprocessor 24mus 105C 4.57mm 6V
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant

Dimensions

Height Seated (Max) 4.57mm

Technical

RAM (bytes) 128
Number of Programmable I/O 32
Number of A/D Converters 1
Core Architecture 8051
ROM (words) 4096
Sampling Rate 105 ksps
Address Bus Width 16
DAC Channels NO
PWM Channels NO
Data Bus Width 8b
DMA Channels NO
Has ADC NO
Access Time 24 μs
Frequency (Max) 24MHz
Bit Size 8
Number of Bits 24
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Memory Type FLASH
RAM Size 128B
Number of I/O 32
Memory Size 4kB
Min Supply Voltage 4V
Max Supply Voltage 6V
Interface SPI
Temperature Grade COMMERCIAL
Power Supplies 5V
Operating Supply Voltage 5V
Qualification Status Not Qualified
Pin Count 44
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 24MHz
Supply Voltage 5V
Peak Reflow Temperature (Cel) 225
Terminal Form J BEND
Terminal Position QUAD
Technology CMOS
Subcategory Microcontrollers
Min Operating Temperature -40°C
Max Operating Temperature 105°C
Terminal Finish Tin/Lead (Sn/Pb)
Number of Terminations 44
Moisture Sensitivity Level (MSL) 2
JESD-609 Code e0

Physical

Number of Pins 44
Surface Mount YES
Package / Case TSSOP

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