XEF216-256-FB236-C20
RoHS 
RoHS compliant
RoHS compliantPackage 236-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description
XMOS XEF216-256-FB236-C20 8 Core 32 Bit MCU, RISC Architecture, SRAM 256KB, 2MB Internal Flash, 1000 MPIS, JTAG, USB, FBGA-236
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Technical Details
Compliance
RoHS Status ROHS3 Compliant
REACH SVHC Unknown
Technical
Core Architecture XCore
Connectivity RGMII, USB
Program Memory Size 2MB 2M x 8
Core Size 32-Bit 16-Core
Program Memory Type FLASH
Core Processor XCore
Voltage - Supply (Vcc/Vdd) 0.95V~3.6V
Memory Type FLASH
RAM Size 256K x 8
Speed 2000MIPS
Number of I/O 73
Oscillator Type External
Memory Size 2MB
Min Supply Voltage 950mV
Max Supply Voltage 1.05V
Interface USB
Frequency 500MHz
Min Operating Temperature 0°C
Max Operating Temperature 70°C
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Discontinued
Series XEF
Published 2015
Packaging Tray
Operating Temperature 0°C~70°C TA
Physical
Supplier Device Package 236-FBGA (10x10)
Number of Pins 236
Package / Case 236-LFBGA
Mounting Type Surface Mount
Alternative Model
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