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LM3S6611-IBZ50-A2

Texas Instruments
RoHS
RoHS RoHS compliant
Package 108-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description ARM Microcontrollers - MCU IC ARM CORTEX MCU
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Technical Details

Compliance

Lead Free Lead Free
RoHS Status ROHS3 Compliant
Radiation Hardening No

Dimensions

Thickness 950μm
Width 10mm
Length 10mm
Height 1.5mm

Technical

Number of Serial I/Os 8
Number of ADC Channels 0
Number of UART Channels 3
Integrated Cache YES
Format FIXED-POINT
Low Power Mode YES
Boundary Scan YES
Core Architecture ARM
Number of Timers/Counters 6
PWM Channels YES
Data Bus Width 32b
DMA Channels NO
Has ADC NO
Watchdog Timer Yes
Bit Size 32
Connectivity Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Program Memory Size 128KB 128K x 8
Core Size 32-Bit
Program Memory Type FLASH
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Core Processor ARM? Cortex?-M3
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) 2.25V~2.75V
RAM Size 32K x 8
Number of I/O 46
Oscillator Type Internal
Memory Size 128kB
Interface Ethernet, I2C, IrDA, SPI, UART, USART
Supply Voltage-Max (Vsup) 2.75V
Operating Supply Voltage 3.3V
Pin Count 108
Base Part Number LM3S6611
Frequency 50MHz
Supply Voltage 2.5V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Microcontrollers
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 108
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Pbfree Code yes
JESD-609 Code e1
Series Stellaris? ARM? Cortex?-M3S 6000
Packaging Tray
Operating Temperature -40°C~85°C TA

Physical

Number of Pins 108
Package / Case 108-LFBGA
Mounting Type Surface Mount
Mount Surface Mount

Supply Chain

Lifecycle Status NRND (Last Updated: 1 week ago)
Factory Lead Time 20 Weeks

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