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SPC5746CFK1ACKU6

NXP USA Inc.
RoHS
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Package 176-LQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description DUAL CORE 3M FLASH 384
PDF
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Inventory: 1605
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Technical Details

Technical

EEPROM Size 128K x 8
Data Converter A/D 36x10b, 16x12b
Connectivity CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Program Memory Size 3MB 3M x 8
Core Size 32-Bit Dual-Core
Program Memory Type FLASH
Peripherals DMA, LVD, POR, WDT
Core Processor e200z2, e200z4
Voltage - Supply (Vcc/Vdd) 3.15V~5.5V
RAM Size 384K x 8
Speed 80MHz, 200MHz
Number of I/O 129
Oscillator Type Internal
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Series MPC57xx
Operating Temperature -40°C~85°C TA

Physical

Package / Case 176-LQFP Exposed Pad
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 2 Weeks

Alternative Model

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