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SPC5566MVR144

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 416-BBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 32-bit MPC55xx e200 RISC 3072KB Flash 1.8V/2.5V/3.3V/5V 416-Pin BGA Brick
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 416-BBGA
Surface Mount YES

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2003
Series MPC55xx Qorivva
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 416
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number PC5566
JESD-30 Code S-PBGA-B416
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.65V
Power Supplies 1.53.35V
Supply Voltage-Min (Vsup) 1.35V
Oscillator Type External
Number of I/O 256
Speed 144MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.35V~1.65V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor e200z6
Peripherals DMA, POR, PWM, WDT
Clock Frequency 20MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 3MB 3M x 8
Connectivity CANbus, EBI/EMI, Ethernet, SCI, SPI
Supply Current-Max 820mA
Bit Size 32
Data Converter A/D 40x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Address Bus Width 24
ROM (words) 3145728
Screening Level AEC-Q100
External Data Bus Width 32

Dimensions

Height Seated (Max) 2.55mm
Length 27mm
Width 27mm

Compliance

RoHS Status ROHS3 Compliant

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