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SPC5554MVR132

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 416-BBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 32-bit MPC55xx e200 RISC 2048KB Flash 1.8V/2.5V/3.3V/5V 416-Pin BGA Tray
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 27mm
Length 27mm
Height Seated (Max) 2.55mm

Technical

RAM (bytes) 65536
External Data Bus Width 32
Screening Level AEC-Q100
ROM (words) 2097152
Address Bus Width 24
DAC Channels NO
PWM Channels YES
DMA Channels YES
Has ADC YES
Data Converter A/D 40x12b
Bit Size 32
Supply Current-Max 875mA
Connectivity CANbus, EBI/EMI, SCI, SPI
Program Memory Size 2MB 2M x 8
Core Size 32-Bit
Program Memory Type FLASH
Clock Frequency 20MHz
Peripherals DMA, POR, PWM, WDT
Core Processor e200z6
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Voltage - Supply (Vcc/Vdd) 1.35V~1.65V
RAM Size 64K x 8
Speed 132MHz
Number of I/O 256
Oscillator Type External
Supply Voltage-Min (Vsup) 1.35V
Power Supplies 1.53.35V
Supply Voltage-Max (Vsup) 1.65V
Qualification Status Not Qualified
JESD-30 Code S-PBGA-B416
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 1mm
Supply Voltage 1.5V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Microcontrollers
HTS Code 8542.31.00.01
Additional Feature ALSO OPERATES AT 3.3 V
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A991.A.2
Number of Terminations 416
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Not For New Designs
JESD-609 Code e1
Series MPC55xx Qorivva
Published 2003
Packaging Tray
Operating Temperature -40°C~125°C TA

Physical

Surface Mount YES
Package / Case 416-BBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 13 Weeks

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