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MK60DN256VMC10

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 121-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 32-Bit K60 ARM Cortex M4 RISC 256KB Flash 1.8V/2.5V/3.3V 121-Pin MAP-BGA Tray
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Buying Options
Total Price: USD $129.49
Unit Price: USD $129.4926
≥1 USD $129.4926
≥10 USD $125.17675
≥100 USD $112.2273
Inventory: 986
Minimum: 1
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 8mm
Length 8mm
Height Seated (Max) 1.52mm

Technical

RAM (bytes) 65536
CPU Family CORTEX-M4
ROM (words) 262144
DAC Channels YES
PWM Channels YES
DMA Channels YES
Has ADC YES
Data Converter A/D 42x16b; D/A 2x12b
Bit Size 32
Supply Current-Max 77mA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Program Memory Size 256KB 256K x 8
Core Size 32-Bit
Program Memory Type FLASH
Clock Frequency 32MHz
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Core Processor ARM? Cortex?-M4
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
RAM Size 64K x 8
Speed 100MHz
Number of I/O 100
Oscillator Type Internal
Supply Voltage-Min (Vsup) 1.71V
Power Supplies 1.8/3V
Supply Voltage-Max (Vsup) 3.6V
Qualification Status Not Qualified
JESD-30 Code S-PBGA-B121
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 0.65mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Microcontrollers
HTS Code 8542.31.00.01
Terminal Finish TIN SILVER COPPER
ECCN Code 3A991.A.2
Number of Terminations 121
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Kinetis K60
Published 2013
Packaging Tray
Operating Temperature -40°C~105°C TA

Physical

Surface Mount YES
Package / Case 121-LFBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 13 Weeks

Alternative Model

MAX6390LT31D7+T

MAX6390LT31D7+T

Maxim Integrated

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