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MC9S12XEP100CVL

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 208-BGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description 16-bit Microcontrollers - MCU 1M FLASH 64K RAM
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Buying Options
Total Price: USD $261.51
Unit Price: USD $261.508794
≥1 USD $261.508794
≥10 USD $246.706404
≥100 USD $232.741894
≥500 USD $219.567824
≥1000 USD $207.139463
Inventory: 1167
Minimum: 1
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Technical Details

Supply Chain

Factory Lead Time 16 Weeks

Physical

Mounting Type Surface Mount
Package / Case 208-BGA
Surface Mount YES

Technical

Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2012
Series HCS12X
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
Additional Feature IT ALSO REQUIRES 5 V I/O SUPPLY
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC9S12XEP100
JESD-30 Code S-PBGA-B208
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.98V
Power Supplies 3.3/5V
Supply Voltage-Min (Vsup) 1.72V
Oscillator Type External
Number of I/O 152
Speed 50MHz
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 1.72V~5.5V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Peripherals LVD, POR, PWM, WDT
Clock Frequency 40MHz
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 1MB 1M x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Bit Size 32
Data Converter A/D 32x12b
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels NO
Address Bus Width 23
ROM (words) 1048576
EEPROM Size 4K x 8
CPU Family CPU12
External Data Bus Width 16

Dimensions

Height Seated (Max) 2mm
Length 17mm
Width 17mm

Compliance

RoHS Status ROHS3 Compliant

Alternative Model

TC75W54FK(TE85L,F)

TC75W54FK(TE85L,F)

Toshiba Semiconductor and Storage

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