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FS32R372SBK0MMMT

NXP USA Inc.
RoHS
RoHS RoHS compliant
Package 257-LFBGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description 768KB SRAM 1.3MB FLASH
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Technical

EEPROM Size 32K x 8
Data Converter A/D 16x12b SAR
Connectivity CANbus, I2C, LINbus, SPI
Program Memory Size 1.3MB 1.3M x 8
Core Size 32-Bit Dual-Core
Program Memory Type FLASH
Peripherals POR, PWM, WDT
Core Processor e200z7260
Voltage - Supply (Vcc/Vdd) 1.19V~5.5V
RAM Size 768K x 8
Speed 240MHz
Oscillator Type Internal
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
Operating Temperature -40°C~125°C TA

Physical

Package / Case 257-LFBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 2 Weeks

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