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DSPIC33EP64GS505-E/PT

Microchip Technology
RoHS
RoHS RoHS compliant
Package 48-TQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description 64KB flash,70MIPS,DSC optimized for digital power applications
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Technical Details

Supply Chain

Factory Lead Time 17 Weeks

Physical

Mounting Type Surface Mount
Package / Case 48-TQFP Exposed Pad
Supplier Device Package 48-TQFP-EP (7x7)

Technical

Operating Temperature -40°C~125°C TA
Packaging Tray
Published 2018
Series Automotive, AEC-Q100, dsPIC? 33EP
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Base Part Number DSPIC33EP64GS505
Interface I2C, IrDA, LIN, SPI, UART, USART
Memory Size 64kB
Oscillator Type Internal
Number of I/O 35
Speed 60 MIPs
RAM Size 8K x 8
Memory Type FLASH
Voltage - Supply (Vcc/Vdd) 3V~3.6V
Core Processor dsPIC
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type FLASH
Core Size 16-Bit
Program Memory Size 64KB 64K x 8
Connectivity I2C, IrDA, LINbus, SPI, UART/USART
Data Converter A/D 19x12b; D/A 1x12b
Core Architecture dsPIC

Compliance

RoHS Status ROHS3 Compliant

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