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DSPIC33EP256GM310-I/PF

Microchip Technology
RoHS
RoHS RoHS compliant
Package 100-TQFP
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 16BIT 256KB FLASH 100TQFP
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Length 14mm
Height Seated (Max) 1.2mm

Technical

RAM (words) 16384
Format FLOATING-POINT
Screening Level TS 16949
On Chip Program ROM Width 8
ROM (words) 262144
DAC Channels NO
PWM Channels YES
Data Bus Width 16b
DMA Channels YES
Has ADC YES
Data Converter A/D 49x10b/12b
Bit Size 16
Supply Current-Max 60mA
Connectivity I2C, IrDA, LINbus, QEI, SPI, UART/USART
Program Memory Size 256KB 85.5K x 24
Core Size 16-Bit
Program Memory Type FLASH
Clock Frequency 60MHz
Peripherals Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Core Processor dsPIC
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Voltage - Supply (Vcc/Vdd) 3V~3.6V
RAM Size 32K x 8
Speed 70 MIPs
Number of I/O 85
Oscillator Type Internal
Supply Voltage-Min (Vsup) 3V
Power Supplies 3.3V
Supply Voltage-Max (Vsup) 3.6V
Qualification Status Not Qualified
JESD-30 Code S-PQFP-G100
Base Part Number DSPIC33EP256GM310
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 0.5mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 260
Terminal Form GULL WING
Terminal Position QUAD
Technology CMOS
Subcategory Digital Signal Processors
Terminal Finish Matte Tin (Sn) - annealed
Number of Terminations 100
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e3
Series dsPIC? 33EP
Published 2013
Packaging Tray
Operating Temperature -40°C~85°C TA

Physical

Surface Mount YES
Package / Case 100-TQFP
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 23 Weeks

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