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DSPIC33EP128GM706-E/MR

Microchip Technology
RoHS
RoHS RoHS compliant
Package 64-VFQFN Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description IC MCU 16BIT 128KB FLASH 64QFN
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 9mm
Length 9mm
Height Seated (Max) 1mm

Technical

RAM (words) 8192
Format FLOATING-POINT
Screening Level TS 16949
On Chip Program ROM Width 8
ROM (words) 131072
DAC Channels NO
PWM Channels YES
DMA Channels YES
Has ADC YES
Data Converter A/D 30x10b/12b
Bit Size 16
Supply Current-Max 50mA
Connectivity CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART
Program Memory Size 128KB 43K x 24
Core Size 16-Bit
Program Memory Type FLASH
Clock Frequency 60MHz
Peripherals Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Core Processor dsPIC
uPs/uCs/Peripheral ICs Type MICROCONTROLLER
Voltage - Supply (Vcc/Vdd) 3V~3.6V
RAM Size 16K x 8
Speed 60 MIPs
Number of I/O 53
Oscillator Type Internal
Memory Size 128kB
Supply Voltage-Min (Vsup) 3V
Power Supplies 3.3V
Supply Voltage-Max (Vsup) 3.6V
Qualification Status Not Qualified
JESD-30 Code S-PQCC-N64
Base Part Number DSPIC33EP128GM706
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 0.5mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 260
Terminal Form NO LEAD
Terminal Position QUAD
Technology CMOS
Subcategory Digital Signal Processors
HTS Code 8542.31.00.01
Terminal Finish Matte Tin (Sn) - annealed
ECCN Code 3A001.A.3
Number of Terminations 64
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Part Status Active
JESD-609 Code e3
Series Automotive, AEC-Q100, dsPIC? 33EP
Published 2013
Packaging Tube
Operating Temperature -40°C~125°C TA

Physical

Surface Mount YES
Package / Case 64-VFQFN Exposed Pad
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 23 Weeks

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