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XE167G96F66LACFXQMA1

Infineon Technologies
RoHS
RoHS RoHS compliant
Package 144-LQFP Exposed Pad
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description MCU 16-Bit XE166 C166 CISC/DSP/RISC 768KB Flash 3.3V/5V 144-Pin LQFP Tray
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Technical Details

Compliance

Lead Free Lead Free
RoHS Status ROHS3 Compliant

Technical

Number of Timers/Counters 5
Halogen Free Halogen Free
Data Bus Width 16b
Watchdog Timer Yes
Data Converter A/D 16x10b
Connectivity CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Program Memory Size 768KB 768K x 8
Core Size 16-Bit
Program Memory Type FLASH
Peripherals I2S, POR, PWM, WDT
Core Processor C166SV2
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Voltage - Supply (Vcc/Vdd) 3V~5.5V
RAM Size 82K x 8
Number of I/O 118
Oscillator Type Internal
Memory Size 768kB
Interface CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART
Base Part Number SA*XE167G
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Frequency 66MHz
Peak Reflow Temperature (Cel) NOT SPECIFIED
Technology CMOS
Max Power Dissipation 1W
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Not For New Designs
Series XE16x
Published 2008
Packaging Tray
Operating Temperature -40°C~85°C TA

Physical

Number of Pins 144
Package / Case 144-LQFP Exposed Pad
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 18 Weeks

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