MC56F8157VVFE
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - Microcontrollers
Description
Lead Free RoHS Compliant BALL BOTTOM Microcontroller 3.3V 105C 40MHz 1mm
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Technical Details
Physical
Package / Case BGA
Surface Mount YES
Number of Pins 160
Technical
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3
Number of Terminations 160
ECCN Code 3A991
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 105°C
Min Operating Temperature -40°C
HTS Code 8542.31.00.01
Subcategory Microcontrollers
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1mm
Frequency 40MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Power Supplies 3.3V
Temperature Grade INDUSTRIAL
Interface EBI/EMI, SCI, SPI
Memory Size 256kB
Oscillator Type External
Number of I/O 76
RAM Size 16kB
Memory Type FLASH
Peripherals POR, PWM, WDT
Bit Size 16
Frequency (Max) 60MHz
Data Bus Width 16b
Halogen Free Halogen Free
ROM (words) 131072
CPU Family 56800E
RAM (bytes) 16384
Compliance
RoHS Status RoHS Compliant
Lead Free Lead Free
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