SLE66R35RMCC2XHSA1
RoHS 
RoHS compliant
RoHS compliantPackage Die
Category Integrated Circuits (ICs) / Embedded - Microcontrollers - Application Specific
Description
Memory Chip with Mifare Compatibility
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Technical Details
Supply Chain
Factory Lead Time 26 Weeks
Physical
Mounting Type Surface Mount
Package / Case Die
Supplier Device Package Wafer
Technical
Operating Temperature -25°C~70°C
Packaging Tape & Reel (TR)
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature 70°C
Min Operating Temperature -25°C
Applications Security
Interface ISO14443-3 Type A
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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