TE0803-03-3AE11-A
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Category Integrated Circuits (ICs) / Embedded - Microcontroller, Microprocessor, FPGA Modules
Description
TE0803 MPU Core B2B Embedded Module 0C~85C 128MB 2.05x 2.99 52mmx76mm
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Technical Details
Supply Chain
Factory Lead Time 12 Weeks
Technical
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
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