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TE0803-02-04EG-1EA

Trenz Electronic GmbH
RoHS
/
Package /
Category Integrated Circuits (ICs) / Embedded - Microcontroller, Microprocessor, FPGA Modules
Description TE0803 MPU Core B2B Embedded Module 0C~85C 128MB 2.05x 2.99 52mmx76mm
PDF
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Inventory: 6293
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Technical Details

Technical

Flash Size 128MB
Module/Board Type MPU Core
Core Processor Zynq UltraScale+ XCZU4EG-1SFVC784E
RAM Size 2GB
Connector Type B2B
Moisture Sensitivity Level (MSL) Not Applicable
Part Status Obsolete
Size / Dimension 2.05 x 2.99 52mmx76mm
Series TE0803
Operating Temperature 0°C~85°C

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