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XCV300E6FGG256I

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS RoHS Compliant BALL BOTTOM field programmable gate array 100C 16kB 0.47ns 357MHz
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Technical Details

Compliance

RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Width 17mm
Length 17mm
Height Seated (Max) 2mm

Technical

Number of Equivalent Gates 82944
Combinatorial Delay of a CLB-Max 0.47 ns
Speed Grade 6
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 176
Clock Frequency 357MHz
RAM Size 16kB
Supply Voltage-Max (Vsup) 1.89V
Operating Supply Voltage 1.8V
Number of Outputs 176
Pin Count 256
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 1.8V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Min Operating Temperature -40°C
Max Operating Temperature 100°C
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
ECCN Code EAR99
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3
Pbfree Code yes
JESD-609 Code e1

Physical

Surface Mount YES
Package / Case FBGA

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