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XC6SLX75-L1FG676C

Xilinx
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 387kB 0.46ns 1V
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 27mm
Length 27mm
Height Seated (Max) 2.44mm

Technical

Combinatorial Delay of a CLB-Max 0.46 ns
Number of Registers 93296
Number of Logic Blocks (LABs) 5831
Number of Logic Elements/Cells 74637
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
RAM Size 387kB
Number of I/O 408
Temperature Grade OTHER
Power Supplies 12.5/3.3V
Supply Voltage-Max (Vsup) 1.05V
Operating Supply Voltage 1V
Qualification Status Not Qualified
Number of Outputs 408
Pin Count 676
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Min Operating Temperature 0°C
Max Operating Temperature 85°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3
Pbfree Code no
JESD-609 Code e0

Physical

Number of Pins 676
Package / Case BGA
Mount Surface Mount

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