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XC6SLX150-N3FG676C

Xilinx
RoHS
/
Package BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS OTHER RoHS Compliant BALL field programmable gate array 85C 603kB 1.28ns 806MHz
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Technical Details

Compliance

RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Width 27mm
Length 27mm
Height Seated (Max) 2.44mm

Technical

Combinatorial Delay of a CLB-Max 0.26 ns
Number of Registers 184304
Number of Logic Blocks (LABs) 11519
Number of Logic Elements/Cells 147443
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Propagation Delay 1.28 ns
Clock Frequency 806MHz
RAM Size 603kB
Number of I/O 498
Temperature Grade OTHER
Power Supplies 1.21.2/3.32.5/3.3V
Supply Voltage-Max (Vsup) 1.26V
Operating Supply Voltage 1.2V
Number of Outputs 498
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Min Operating Temperature 0°C
Max Operating Temperature 85°C
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A991.D
Number of Terminations 676
Moisture Sensitivity Level (MSL) 3
JESD-609 Code e0

Physical

Number of Pins 676
Package / Case BGA
Mount Surface Mount

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