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XC3S2000-4FGG900I

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description FBGA Surface Mount FIELD PROGRAMMABLE GATE ARRAY e1 field programmable gate array 1.75mm 1.26V 630MHz 0.61ns
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Technical Details

Supply Chain

Factory Lead Time 6 Weeks

Physical

Mount Surface Mount
Package / Case FBGA
Number of Pins 900

Technical

Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3
Number of Terminations 900
ECCN Code 3A991.D
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 900
Number of Outputs 565
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5V
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
Number of I/O 565
RAM Size 90kB
Clock Frequency 630MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 46080
Number of Gates 2e+06
Number of Logic Blocks (LABs) 5120
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.61 ns
Number of Equivalent Gates 2000000

Dimensions

Height 1.75mm
Length 31mm
Width 31mm

Compliance

RoHS Status RoHS Compliant

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