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XC2S150E-6FG456I

Xilinx
RoHS
/
Package FBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS RoHS Compliant BALL BOTTOM field programmable gate array 100C 6kB 0.47ns 357MHz
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Technical Details

Compliance

RoHS Status RoHS Compliant
Radiation Hardening No

Dimensions

Width 23mm
Length 23mm

Technical

Number of Equivalent Gates 52000
Number of Logic Cells 3888
Number of CLBs 864
Combinatorial Delay of a CLB-Max 0.47 ns
Speed Grade 6
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 263
Clock Frequency 357MHz
RAM Size 6kB
Supply Voltage-Max (Vsup) 1.89V
Operating Supply Voltage 1.8V
Number of Outputs 263
Pin Count 456
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1mm
Supply Voltage 1.8V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES = 150000
Min Operating Temperature -40°C
Max Operating Temperature 100°C
ECCN Code 3A991.D
Number of Terminations 456
Moisture Sensitivity Level (MSL) 3
Pbfree Code no
JESD-609 Code e0

Physical

Surface Mount YES
Package / Case FBGA

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