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XCVU13P-L2FIGD2104E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 2104-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ROHS3Compliant BALL Active BOTTOM field programmable gate array 0C~110C TJ 11.8MB 0.72V 4.59mm
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 52.5mm
Length 52.5mm
Height Seated (Max) 4.59mm

Technical

Number of LABs/CLBs 216000
Total RAM Bits 514867200
Number of Logic Elements/Cells 3780000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
RAM Size 11.8MB
Number of I/O 676
JESD-30 Code S-PBGA-B2104
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Reach Compliance Code not_compliant
Terminal Pitch 1mm
Supply Voltage 0.72V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 0.698V~0.876V
HTS Code 8542.39.00.01
Part Status Active
Series Virtex? UltraScale+?
Packaging Tray
Operating Temperature 0°C~110°C TJ

Physical

Surface Mount YES
Package / Case 2104-BBGA, FCBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 11 Weeks

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