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XCVU125-2FLVB1760I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description 2012 ROHS3Compliant BALL Active FPGA -40C~100C TJ 0.95V
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature -40°C~100°C TJ
Packaging Bulk
Published 2012
Series Virtex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1760
Number of I/O 702
Organization 1200 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1566600
Total RAM Bits 90726400
Number of LABs/CLBs 89520
Number of CLBs 1200

Compliance

RoHS Status ROHS3 Compliant

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