XCVU125-2FLVA2104E
RoHS 
RoHS compliant
RoHS compliantPackage 2104-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Copper Silver Tin 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 11.1MB 950mV
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 2104-BBGA, FCBGA
Technical
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Virtex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Operating Supply Voltage 950mV
Number of I/O 832
RAM Size 11.1MB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1566600
Total RAM Bits 90726400
Number of LABs/CLBs 89520
Speed Grade 2
Number of Registers 1.43232e+06
Compliance
RoHS Status ROHS3 Compliant
Alternative Model
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