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XCVU095-3FFVB1760E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description 2012 ROHS3Compliant BALL Active field programmable gate array 0C~100C TJ 1V 3.81mm
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Technical Details

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 42.5mm
Length 42.5mm
Height Seated (Max) 3.81mm

Technical

Number of CLBs 768
Number of LABs/CLBs 67200
Total RAM Bits 62259200
Number of Logic Elements/Cells 1176000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Organization 768 CLBS
Number of I/O 702
JESD-30 Code S-PBGA-B1760
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Terminal Pitch 1mm
Supply Voltage 1V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 0.970V~1.030V
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A001.A.7.B
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Virtex? UltraScale?
Published 2012
Packaging Bulk
Operating Temperature 0°C~100°C TJ

Physical

Surface Mount YES
Package / Case 1760-BBGA, FCBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 10 Weeks

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