XCV600-6FG676C
RoHS
/
Package 676-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Virtex? XCV600 676-BBGA FCBGA Tin/Lead (Sn63Pb37) field programmable gate array 2.6mm 1.2/3.62.5V 333MHz 0.6ns
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2000
Series Virtex?
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV600
Pin Count 676
JESD-30 Code S-PBGA-B676
Number of Outputs 444
Qualification Status Not Qualified
Power Supplies 1.2/3.62.5V
Number of I/O 444
RAM Size 12kB
Clock Frequency 333MHz
Number of Inputs 444
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 15552
Total RAM Bits 98304
Number of Gates 661111
Number of LABs/CLBs 3456
Combinatorial Delay of a CLB-Max 0.6 ns
Dimensions
Height Seated (Max) 2.6mm
Length 27mm
Width 27mm
Compliance
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
Alternative Model
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