XCV2000E-8BG560C
RoHS
/
Package 560-LBGA Exposed Pad, Metal
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Virtex?-E XCV2000E 560-LBGA Exposed Pad Metal Tin/Lead (Sn63Pb37) field programmable gate array 1.7mm 1.8V 416MHz 0.4ns
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Technical
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2004
Series Virtex?-E
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV2000E
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404
Operating Supply Voltage 1.8V
Number of I/O 404
RAM Size 80kB
Clock Frequency 416MHz
Number of Inputs 404
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 43200
Total RAM Bits 655360
Number of Gates 2541952
Number of LABs/CLBs 9600
Speed Grade 8
Combinatorial Delay of a CLB-Max 0.4 ns
Dimensions
Height Seated (Max) 1.7mm
Length 42.5mm
Width 42.5mm
Compliance
Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Radiation Hardening No
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