XCV2000E-6FG860I
RoHS
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Package 860-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Contains Lead CMOS 2004 Non-RoHS Compliant FPGA -40C~100C TJ 80kB 0.47ns 357MHz
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Technical Details
Compliance
Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Dimensions
Width 42.5mm
Length 42.5mm
Height Seated (Max) 2.2mm
Technical
Number of Equivalent Gates 518400
Combinatorial Delay of a CLB-Max 0.47 ns
Number of LABs/CLBs 9600
Number of Gates 2541952
Total RAM Bits 655360
Number of Logic Elements/Cells 43200
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 660
Clock Frequency 357MHz
RAM Size 80kB
Number of I/O 660
Power Supplies 1.2/3.61.8V
Qualification Status Not Qualified
Number of Outputs 660
JESD-30 Code S-PBGA-B860
Pin Count 860
Base Part Number XCV2000E
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code not_compliant
Terminal Pitch 1mm
Supply Voltage 1.8V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 1.71V~1.89V
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A001.A.7.A
Number of Terminations 860
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series Virtex?-E
Published 2004
Packaging Tray
Operating Temperature -40°C~100°C TJ
Physical
Package / Case 860-BGA
Mounting Type Surface Mount
Mount Surface Mount
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