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XCKU115-3FLVB1760E

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 1760-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS 2012 ROHS3Compliant BALL field programmable gate array 0C~100C TJ 1V 3.71mm
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Technical Details

Supply Chain

Factory Lead Time 10 Weeks

Physical

Mounting Type Surface Mount
Package / Case 1760-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Kintex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A001.A.7.B
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Packing Method TRAY
Technology CMOS
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1760
Number of Outputs 702
Qualification Status Not Qualified
Power Supplies 1V
Number of I/O 702
Number of Inputs 702
Organization 5520 CLBS
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 1451100
Total RAM Bits 77721600
Number of LABs/CLBs 82920
Number of CLBs 5520

Dimensions

Height Seated (Max) 3.71mm
Length 42.5mm
Width 42.5mm

Compliance

RoHS Status ROHS3 Compliant

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