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XCKU115-2FLVA2104I

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 2104-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS 2012 ROHS3Compliant BALL FPGA -40C~100C TJ 0.95V 3.71mm
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Technical Details

Technical

Technology CMOS
Packing Method TRAY
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
ECCN Code 3A001.A.7.B
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
JESD-609 Code e1
Series Kintex? UltraScale?
Published 2012
Packaging Bulk
Operating Temperature -40°C~100°C TJ
Number of CLBs 5520
Number of LABs/CLBs 82920
Total RAM Bits 77721600
Number of Logic Elements/Cells 1451100
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Organization 5520 CLBS
Number of Inputs 832
Number of I/O 832
Power Supplies 0.95V
Qualification Status Not Qualified
Number of Outputs 832
JESD-30 Code S-PBGA-B2104
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Terminal Pitch 1mm
Supply Voltage 0.95V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 0.922V~0.979V

Physical

Surface Mount YES
Package / Case 2104-BBGA, FCBGA
Mounting Type Surface Mount

Supply Chain

Factory Lead Time 10 Weeks

Compliance

RoHS Status ROHS3 Compliant

Dimensions

Width 40mm
Length 40mm
Height Seated (Max) 3.71mm

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