XCKU095-1FFVC1517I
RoHS 
RoHS compliant
RoHS compliantPackage 1517-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
768CLBS Kintex? UltraScale? 1517-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 4.09mm 950mV 7.4MB -40C~100C TJ
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Technical Details
Supply Chain
Factory Lead Time 10 Weeks
Physical
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Technical
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Published 2012
Series Kintex? UltraScale?
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Packing Method TRAY
Technology CMOS
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 520
Qualification Status Not Qualified
Number of CLBs 768
Number of Registers 1.0752e+06
Speed Grade 1
Number of LABs/CLBs 67200
Total RAM Bits 60518400
Number of Logic Elements/Cells 1176000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Organization 768 CLBS
Number of Inputs 520
RAM Size 7.4MB
Number of I/O 520
Power Supplies 0.95V
Operating Supply Voltage 950mV
Compliance
RoHS Status ROHS3 Compliant
Dimensions
Width 40mm
Length 40mm
Height Seated (Max) 4.09mm
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