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XC7K410T-2FFV900C

Xilinx Inc.
RoHS
RoHS RoHS compliant
Package 900-BBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Kintex?-7 900-BBGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) Surface Mount field programmable gate array 3.35mm 1V 0.61ns 0C~85C TJ
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Technical Details

Supply Chain

Factory Lead Time 12 Weeks

Physical

Mounting Type Surface Mount
Package / Case 900-BBGA, FCBGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Bulk
Published 2009
Series Kintex?-7
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 0.97V~1.03V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B900
Number of I/O 500
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 406720
Total RAM Bits 29306880
Number of LABs/CLBs 31775
Combinatorial Delay of a CLB-Max 0.61 ns

Dimensions

Height Seated (Max) 3.35mm
Length 31mm
Width 31mm

Compliance

RoHS Status ROHS3 Compliant

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