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XC6SLX150T-N3FGG900C

Xilinx Inc.
RoHS
/
Package 900-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS 2008 RoHS Compliant BALL FPGA 0C~85C TJ 603kB 0.26ns 806MHz
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 900-BBGA
Number of Pins 900

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2008
Series Spartan?-6 LXT
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish TIN SILVER COPPER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC6SLX150
Number of Outputs 540
Operating Supply Voltage 1.2V
Power Supplies 1.21.2/3.32.5/3.3V
Number of I/O 540
RAM Size 603kB
Clock Frequency 806MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 147443
Total RAM Bits 4939776
Number of LABs/CLBs 11519
Number of Registers 184304
Combinatorial Delay of a CLB-Max 0.26 ns

Dimensions

Height Seated (Max) 2.6mm
Length 31mm
Width 31mm

Compliance

Radiation Hardening No
RoHS Status RoHS Compliant

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