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XC4VLX15-11SF363I

Xilinx Inc.
RoHS
/
Package 363-FBGA, FCBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description CMOS 1999 Non-RoHS Compliant BALL FPGA -40C~100C TJ 108kB 1205MHz 1.2V
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Technical Details

Compliance

RoHS Status Non-RoHS Compliant

Dimensions

Width 17mm
Length 17mm
Height Seated (Max) 1.99mm

Technical

Speed Grade 11
Number of LABs/CLBs 1536
Total RAM Bits 884736
Number of Logic Elements/Cells 13824
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency 1205MHz
RAM Size 108kB
Number of I/O 240
Operating Supply Voltage 1.2V
Qualification Status Not Qualified
Number of Outputs 240
Pin Count 363
Base Part Number XC4VLX15
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code not_compliant
Terminal Pitch 0.8mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 1.14V~1.26V
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code 3A991.D
Number of Terminations 363
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Part Status Active
Pbfree Code no
JESD-609 Code e0
Series Virtex?-4 LX
Published 1999
Packaging Tray
Operating Temperature -40°C~100°C TJ

Physical

Number of Pins 363
Package / Case 363-FBGA, FCBGA
Mounting Type Surface Mount
Mount Surface Mount

Supply Chain

Factory Lead Time 10 Weeks

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