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XC4062XL-3BG560C

Xilinx Inc.
RoHS
/
Package 560-LBGA Exposed Pad, Metal
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Contains Lead CMOS 1999 Non-RoHS Compliant field programmable gate array 0C~85C TJ 9kB 1.6ns 166MHz
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Technical Details

Compliance

Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Radiation Hardening No

Dimensions

Width 42.5mm
Length 42.5mm
Height Seated (Max) 1.7mm

Technical

Number of Equivalent Gates 40000
Combinatorial Delay of a CLB-Max 1.6 ns
Number of Registers 5376
Speed Grade 3
Number of LABs/CLBs 2304
Number of Gates 62000
Total RAM Bits 73728
Number of Logic Elements/Cells 5472
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Clock Frequency 166MHz
RAM Size 9kB
Number of I/O 384
Operating Supply Voltage 3.3V
Number of Outputs 384
Pin Count 560
Base Part Number XC4062XL
Time@Peak Reflow Temperature-Max (s) 30
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 3V~3.6V
Technology CMOS
Subcategory Field Programmable Gate Arrays
Number of Terminations 560
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series XC4000E/X
Published 1999
Packaging Tray
Operating Temperature 0°C~85°C TJ

Physical

Number of Pins 560
Package / Case 560-LBGA Exposed Pad, Metal
Mounting Type Surface Mount
Mount Surface Mount

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