XC4052XL-2BG560C
RoHS
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Package 560-LBGA Exposed Pad, Metal
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
Contains Lead CMOS 1999 Non-RoHS Compliant FPGA 0C~85C TJ 7.6kB 1.5ns 179MHz
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Technical Details
Compliance
Lead Free Contains Lead
RoHS Status Non-RoHS Compliant
Dimensions
Width 42.5mm
Length 42.5mm
Height Seated (Max) 1.7mm
Technical
Number of Equivalent Gates 33000
Combinatorial Delay of a CLB-Max 1.5 ns
Number of LABs/CLBs 1936
Number of Gates 52000
Total RAM Bits 61952
Number of Logic Elements/Cells 4598
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Inputs 352
Clock Frequency 179MHz
RAM Size 7.6kB
Number of I/O 352
Power Supplies 3.3V
Qualification Status Not Qualified
Number of Outputs 352
JESD-30 Code S-PBGA-B560
Pin Count 560
Base Part Number XC4052XL
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code not_compliant
Terminal Pitch 1.27mm
Supply Voltage 3.3V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 3V~3.6V
Technology CMOS
Subcategory Field Programmable Gate Arrays
HTS Code 8542.39.00.01
Terminal Finish Tin/Lead (Sn63Pb37)
Number of Terminations 560
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
JESD-609 Code e0
Series XC4000E/X
Published 1999
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Package / Case 560-LBGA Exposed Pad, Metal
Mounting Type Surface Mount
Mount Surface Mount
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