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XC2VP2-5FG456C

Xilinx Inc.
RoHS
/
Package 456-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Virtex?-II Pro 456-BBGA Tin/Lead (Sn63Pb37) Surface Mount field programmable gate array 2.6mm 1.5V 0.36ns 27kB
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Technical Details

Supply Chain

Factory Lead Time 6 Weeks

Physical

Mounting Type Surface Mount
Package / Case 456-BBGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Bulk
Published 2011
Series Virtex?-II Pro
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Number of Terminations 456
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 456
Number of Outputs 156
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Number of I/O 156
RAM Size 27kB
Number of Inputs 156
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 3168
Total RAM Bits 221184
Number of LABs/CLBs 352
Speed Grade 5
Number of Registers 2816
Combinatorial Delay of a CLB-Max 0.36 ns
Number of CLBs 352

Dimensions

Height Seated (Max) 2.6mm
Length 23mm
Width 23mm

Compliance

RoHS Status Non-RoHS Compliant

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