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U1AFS250-FGG256I

Microsemi Corporation
RoHS
RoHS RoHS compliant
Package 256-LBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description Fusion? U1AFS250 256-LBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 1.68mm 1.5V 4.5kB -40C~100C TJ
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Technical Details

Compliance

RoHS Status RoHS Compliant

Dimensions

Width 17mm
Length 17mm
Height Seated (Max) 1.68mm

Technical

Number of CLBs 6144
Number of Gates 250000
Total RAM Bits 36864
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
RAM Size 4.5kB
Number of I/O 114
Qualification Status Not Qualified
Base Part Number U1AFS250
Time@Peak Reflow Temperature-Max (s) 40
Terminal Pitch 1mm
Supply Voltage 1.5V
Peak Reflow Temperature (Cel) 260
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 1.425V~1.575V
Technology CMOS
HTS Code 8542.39.00.01
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Active
JESD-609 Code e1
Series Fusion?
Published 2013
Packaging Tray
Operating Temperature -40°C~100°C TJ

Physical

Number of Pins 256
Package / Case 256-LBGA
Mounting Type Surface Mount
Mount Surface Mount

Supply Chain

Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 14 Weeks

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