LFXP6E-5F256C
RoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
XP LFXP6 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 17mm 1.2V 400MHz 0.44ns
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Technical Details
Compliance
Lead Free Lead Free
RoHS Status Non-RoHS Compliant
Dimensions
Width 17mm
Length 17mm
Technical
Number of Logic Cells 720
Number of CLBs 720
Combinatorial Delay of a CLB-Max 0.44 ns
Number of Logic Blocks (LABs) 750
Max Frequency 400MHz
Number of Gates 2
Total RAM Bits 73728
Number of Logic Elements/Cells 6000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
RAM Size 9kB
Number of I/O 188
Memory Size 11.9kB
Operating Supply Voltage 1.2V
Qualification Status Not Qualified
Number of Outputs 188
Pin Count 256
Base Part Number LFXP6
Time@Peak Reflow Temperature-Max (s) 30
Reach Compliance Code not_compliant
Terminal Pitch 1mm
Supply Voltage 1.2V
Peak Reflow Temperature (Cel) 225
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 1.14V~1.26V
Technology CMOS
Subcategory Field Programmable Gate Arrays
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code EAR99
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
Pbfree Code no
JESD-609 Code e0
Series XP
Published 2010
Packaging Tray
Operating Temperature 0°C~85°C TJ
Physical
Number of Pins 256
Package / Case 256-BGA
Mounting Type Surface Mount
Mount Surface Mount
Alternative Model
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