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RoHS
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Package 208-BFQFP
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description XP LFXP6 208-BFQFP Tin/Lead (Sn85Pb15) field programmable gate array 4.1mm 1.2V 320MHz 0.63ns
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Technical Details

Physical

Mount Surface Mount
Mounting Type Surface Mount
Package / Case 208-BFQFP
Number of Pins 208

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2000
Series XP
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn85Pb15)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.14V~1.26V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Reach Compliance Code unknown
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFXP6
Pin Count 208
Number of Outputs 142
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Memory Size 11.9kB
Number of I/O 142
RAM Size 9kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 6000
Total RAM Bits 73728
Number of Gates 2
Max Frequency 320MHz
Number of Logic Blocks (LABs) 750
Combinatorial Delay of a CLB-Max 0.63 ns
Number of CLBs 720
Number of Logic Cells 720

Dimensions

Height Seated (Max) 4.1mm

Compliance

RoHS Status Non-RoHS Compliant
Lead Free Lead Free

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