LFXP20C-3FN388I
RoHS
/
Package 388-BBGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
XP LFXP20 388-BBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.6mm 1.8V 320MHz 0.63ns
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Technical Details
Physical
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 388-BBGA
Number of Pins 388
Technical
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2007
Series XP
JESD-609 Code e1
Pbfree Code yes
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory Field Programmable Gate Arrays
Technology CMOS
Voltage - Supply 1.71V~3.465V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.8V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number LFXP20
Pin Count 388
Number of Outputs 268
Qualification Status Not Qualified
Operating Supply Voltage 1.8V
Power Supplies 1.8/2.5/3.3V
Memory Size 59.4kB
Number of I/O 268
RAM Size 49.5kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 20000
Total RAM Bits 405504
Number of Gates 4
Max Frequency 320MHz
Number of Logic Blocks (LABs) 2500
Combinatorial Delay of a CLB-Max 0.63 ns
Dimensions
Height Seated (Max) 2.6mm
Length 23mm
Width 23mm
Compliance
RoHS Status RoHS Compliant
Lead Free Lead Free
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