LFXP20C-3F256C
RoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description
XP LFXP20 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 2.1mm 1.8V 320MHz 0.63ns
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Technical Details
Technical
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Terminal Pitch 1mm
Frequency 320MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFXP20
Pin Count 256
Terminal Form BALL
Terminal Position BOTTOM
Voltage - Supply 1.71V~3.465V
Technology CMOS
Subcategory Field Programmable Gate Arrays
Terminal Finish Tin/Lead (Sn63Pb37)
ECCN Code EAR99
Number of Terminations 256
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Part Status Obsolete
Pbfree Code no
JESD-609 Code e0
Series XP
Published 2008
Packaging Tray
Operating Temperature 0°C~85°C TJ
Combinatorial Delay of a CLB-Max 0.63 ns
Number of Logic Blocks (LABs) 2500
Number of Gates 4
Total RAM Bits 405504
Number of Logic Elements/Cells 20000
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
RAM Size 49.5kB
Number of I/O 188
Memory Size 59.4kB
Power Supplies 1.8/2.5/3.3V
Operating Supply Voltage 1.8V
Number of Outputs 188
Physical
Number of Pins 256
Package / Case 256-BGA
Mounting Type Surface Mount
Mount Surface Mount
Compliance
Lead Free Lead Free
RoHS Status Non-RoHS Compliant
Radiation Hardening No
Dimensions
Width 17mm
Length 17mm
Height Seated (Max) 2.1mm
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