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Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description ECP2 LFE2-12 256-BGA Tin/Lead (Sn63Pb37) field programmable gate array 2.1mm 1.2V 420MHz 0.304ns
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2012
Series ECP2
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Voltage - Supply 1.14V~1.26V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number LFE2-12
Pin Count 256
JESD-30 Code S-PBGA-B256
Number of Outputs 193
Qualification Status Not Qualified
Power Supplies 1.2V
Number of I/O 193
Clock Frequency 420MHz
Number of Inputs 193
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 12000
Total RAM Bits 226304
Number of LABs/CLBs 1500
Combinatorial Delay of a CLB-Max 0.304 ns

Dimensions

Height Seated (Max) 2.1mm
Length 17mm
Width 17mm

Compliance

RoHS Status Non-RoHS Compliant

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