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EPF6010AFC256-3

Intel
RoHS
/
Package 256-BGA
Category Integrated Circuits (ICs) / Embedded - FPGAs (Field Programmable Gate Array)
Description FLEX 6000 256-BGA TIN LEAD Surface Mount field programmable gate array 17mm 3.3V 133MHz 2.5ns
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Technical Details

Physical

Mounting Type Surface Mount
Package / Case 256-BGA
Surface Mount YES

Technical

Operating Temperature 0°C~85°C TJ
Packaging Tray
Series FLEX 6000
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN LEAD
HTS Code 8542.39.00.01
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch 1mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
Number of I/O 171
Clock Frequency 133MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 880
Number of Gates 10000
Number of LABs/CLBs 88
Combinatorial Delay of a CLB-Max 2.5 ns
Number of CLBs 880

Dimensions

Length 17mm
Width 17mm

Compliance

RoHS Status Non-RoHS Compliant

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